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A Robust MEMS Based Multi-Component Sensor for 3D Borehole Seismic Arrays

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The objective of this project was to develop, prototype and test a robust multi-component sensor that combines both Fiber Optic and MEMS technology for use in a borehole seismic array. The use such FOMEMS based sensors allows a dramatic increase in the number of sensors that can be deployed simultaneously in a borehole seismic array. Therefore, denser sampling of the seismic wave field can be afforded, which in turn allows us to efficiently and adequately sample P-wave as well as S-wave for high-resolution imaging purposes. Design, packaging and integration of the multi-component sensors and deployment system will target maximum operating temperature of 350-400 F and a maximum pressure of 15000-25000 psi, thus allowing operation under conditions encountered in deep gas reservoirs. This project aimed at using existing pieces of deployment technology as well as MEMS and fiber-optic technology. A sensor design and analysis study has been carried out and a laboratory prototype of an interrogator for a robust borehole seismic array system has been assembled and validated.

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Last Updated September 29, 2016, 15:46 (EST)
Created September 29, 2016, 15:46 (EST)
Citation Paulsson Geophysical Services ---- Roy Long, A Robust MEMS Based Multi-Component Sensor for 3D Borehole Seismic Arrays, 2016-09-29, https://edx.netl.doe.gov/dataset/a-robust-mems-based-multi-component-sensor-for-3d-borehole-seismic-arrays0
Netl Product yes
Poc Email Roy.long@netl.doe.gov
Point Of Contact Roy Long
Program Or Project KMD
Publication Date 2008-3-31